(1) According to the data of the Venture Capital Connect of the Financial Associated Press, a total of 102 private equity investment and financing events occurred in the domestic semiconductor field in January, an increase of 30.77% from 78 in the previous month;

(2) In January this year, Hillhouse Ventures, IDG Capital, Yida Capital, Qiming Venture Capital, Ant Group, Big Fund Phase II, China Development Bank Manufacturing Transformation and Upgrading Fund and other institutions were active.

"Science and Technology Innovation Board Daily" on February 11 (Reporter Guo Hui) According to the data of the Venture Capital Connect of the Financial Associated Press, a total of 102 private equity investment and financing events occurred in the domestic semiconductor field in January, an increase of 30.77% from 78 in the previous month; The total amount of disclosed financing was about 3.063 billion yuan, a decrease of 60.28% from 7.711 billion yuan in the previous month.

Investment and financing in subdivided fields

From the perspective of subdivisions, the chip design field was the most active in January, with a total of 36 financings; The semiconductor device sector disclosed the highest total financing, about 1.11 billion yuan. Zhanxin Electronics completed the first batch of financing of nearly one billion yuan in Series C led by China Development Bank Manufacturing Transformation and Upgrading Fund, followed by CICC Capital, Goldstone Investment and Xinxin, and Hejian Industrial Soft completed nearly one billion yuan in Series A financing with the participation of Pudong Leading Zone Fund under Pudong Venture Capital Group, which was tied for the highest disclosed investment event in the semiconductor field this month.

According to the classification of chip types, the chip design subdivisions sought after by investors in January include communication chips, Internet of Things chips, memory chips, digital-analog hybrid chips, etc.

Popular investment rounds

From the perspective of investment rounds, in January, in the semiconductor field, in addition to the undisclosed rounds of equity financing, the A round of financing had the largest number of events, with 24 cases, accounting for about 23%; followed by Series B, with 15 cases, accounting for about 15%. In terms of the amount of investment in each round, the total amount of financing disclosed in Series A was the highest, about 1.593 billion yuan, followed by Series C and beyond, about 1.11 billion yuan.

Active investment and financing regions

From a regional point of view, companies in the semiconductor field in Jiangsu, Guangdong, Zhejiang, Beijing, Shanghai and other places were more favored in January, with 10 or more financing events; In terms of individual cities, Suzhou has 13 companies invested, ranking first; It was followed by Shenzhen, with 12 companies invested.

Active investment institution

Investors in January included well-known investment institutions such as Hillhouse Venture Capital, IDG Capital, Linxin Investment, Yida Capital, Qiming Venture Partners, Goldstone Investment, Lightspeed Photosynthesis, Huarui Investment, Gimpo Investment, Zhongke Chuangxing, Weihao Chuangxin, CDH Baifu and other well-known investment institutions.

as well as industry-related investors such as Ant Group, Guoxiang Capital, Legend Capital, Shangqi Capital, Great Wall Motor, United Optoelectronics, Pingao Co., Ltd., and Fuchuang Precision;

At the same time, it also includes Shenzhen Venture Capital, Shenzhen Angel Fund of Funds, Yizhuang State Investment Corporation, Beijing State Management, Zhejiang Industrial Investment, Guolian Group, Shanghai Science and Technology Innovation Group, Xuhui Science and Technology Venture Capital, Big Fund Phase II, China Development Bank Manufacturing Transformation and Upgrading Fund, National Small and Medium-sized Enterprise Development Fund, Ji 60 Fund and other state-owned background investment platforms and government guidance funds.

Some of the active investors in January are listed below:

Notable investment events

Zhanxin Electronics completed the first batch of financing of nearly 1 billion yuan in Series C

Founded in 2017, Junxin Electronics focuses on the field of silicon carbide semiconductors, and is committed to the development of silicon carbide power devices, drive and control chips, silicon carbide power module products, and provides customers with one-stop (Turn-key) chip solutions around SiC applications.

At present, there are more than 60 public patent applications, of which invention applications account for more than 94%, 5 PCT applications, and patent layout in 5 countries/regions, mainly focusing on semiconductors, electronic equipment, transistors, epitaxial layers, power factor correction and other technical fields.

Recently, the company announced the completion of the first batch of nearly one billion yuan in Series C financing, which was led by China Development Bank Manufacturing Transformation and Upgrading Fund, followed by CICC Capital, old shareholders Goldstone Investment and Xinxin. The financing funds will be mainly used for product and process research and development, silicon carbide (SiC) fab expansion and the company's operating expenses. The company expects to complete the Series C financing within the year.

According to the data of the Venture Capital Connect of the Financial Associated Press, taking February 2025 as the forecast base time, the financing forecast probability of Junxin Electronics in the next two years is 93.23%.

Hejian Gongsoft completed nearly one billion yuan in Series A financing

Founded in 2020, Hejian is a provider of high-performance industrial software and solutions, taking the EDA field as a breakthrough direction, and has launched a full-process EDA platform tool for digital chip verification, including functional simulation, prototype verification, hardware simulation, formal verification, etc.

According to the Enterprise Innovation Evaluation Laboratory, Hejian Gongsoft is rated as BBB in the global scientific and technological innovation ability of the core electronics industry, and is a national-level specialized and new "little giant" enterprise, with a total of more than 300 public patent applications, of which invention applications account for more than 93%, mainly focusing on electronic equipment, electronic design, verification technology, database, automation technology and other technical fields.

Recently, the company completed a round of financing of nearly one billion yuan, with the participation of the Pudong Leading Area Fund of Pudong Venture Capital Group.

According to the data of the Venture Capital Connect of the Financial Associated Press, taking February 2025 as the forecast base time, the financing forecast probability of Hejian Gongsoft in the next two years is 97.71%.

Yixing Intelligent completed hundreds of millions of yuan in Series A financing

Founded in 2022, Yixing Intelligence is a "cloud-device integration" general-purpose AI computing chip company focusing on providing advanced AI computing architectures and high-performance parallel computing solutions. The company has completed the development and mass production of several end-side computing chips, including in the field of smart vehicles, and independently developed a new generation of RISC-V computing architecture - EVAMIND™, and will soon launch a new generation of RISC-V computing chip products.

According to the Enterprise Innovation Evaluation Laboratory, Yixing Intelligence's global scientific and technological innovation capability in the field of artificial intelligence is rated B, and there are currently more than 20 public patent applications, of which invention applications account for about 96%, mainly focusing on image processing, lidar, electronic devices, image detection, target tasks and other technical fields.

Recently, the company announced the completion of hundreds of millions of yuan in Series A financing. This round of financing was led by the National SME Development Fund managed by Oriental Fuhai, and jointly increased by old shareholders such as Lion City Capital and Volcanic Stone Investment. The financing funds will be used for the mass production, market expansion and improvement of the software and hardware ecosystem of the company's upcoming RISC-V computing chips.

According to the data of the Venture Capital Connect of the Financial Associated Press, taking February 2025 as the forecast base time, the financing forecast probability of Yixing Intelligence in the next two years is 91.51%.

General list of investment and financing events in January:

Notable fundraising events

Zhejiang Yongyuan Xinhua Semiconductor Venture Capital Fund was established, with a scale of 500 million yuan

Recently, the Zhejiang Yongyuan Xinhua Semiconductor Venture Capital Fund, jointly established by Yongyuan Investment and Zhaohui Tongchuang, has completed the signing of a fund scale of 500 million yuan, and the main investors also include Zhejiang Financial Investment Science and Technology Innovation Fund Phase II, Ningbo Hi-Tech Innovation Capital, etc. It mainly focuses on the core high-end materials of the semiconductor industry, CoWoS, 3D advanced packaging, MEMS sensor technology, CIDM and other key subdivisions to invest, aiming to promote the localization of integrated circuit equipment substitution and application, actively develop integrated circuit processing materials and packaging and testing materials, promote more upstream and downstream enterprises to land in Ningbo, and promote the healthy development of Ningbo's semiconductor industry chain.

Daohe Jingxin Chain Fund was established

Recently, Daohe Tuo Jingxin Chain Fund was announced in Lingang New Area. The fund is backed by Shanghai Daohe Long-term Investment and semiconductor special equipment manufacturer Tuojing Technology (688072. SH). The fund will focus on equity investment in the field of semiconductor equipment and parts, give full play to the leading role of Tuojing Technology in the industrial chain and the advantages of the integration of production and finance of Daohe's long-term investment, closely focus on the upstream links of the semiconductor industry chain, expand and strengthen China's domestic semiconductor equipment and parts industry, and promote the agglomeration and development of the semiconductor parts industry in the Lingang New Area.

Wuxi Integrated Circuit Zhan New Industry Special Fund of Funds plans to invest in Wuxi High-tech Yida Integrated Circuit Equity Investment Fund

Recently, Wuxi Zhanxin Industry Special Fund of Funds intends to participate in the sub-fund through the Jiangsu Province Strategic Emerging Industry Fund of Funds decision-making, the proposed equity sub-fund is Wuxi High-tech Yida Integrated Circuit Equity Investment Fund, and the management agency is Jiangsu Yida Equity Investment Fund Management Co., Ltd. The total scale of the fund is 2 billion yuan, registered in Wuxi Xinwu District, with a duration of 10 years, the fund invests in integrated circuit special equipment and materials, EDA software, IC design, optical chips, vehicle specification chips, third-generation semiconductors and other fields, focusing on the implementation of investment in the upstream and downstream key links of the integrated circuit industry chain, promoting the research and development and breakthrough of key technologies, and promoting industrial upgrading.

Wuxi Integrated Circuit Zhan New Industry Special Fund of Funds plans to invest in Wuxi Huayu Integrated Circuit Industry Fund

Recently, the Wuxi Integrated Circuit Zhanxin Industry Special Fund of Funds intends to participate in the sub-fund through the Jiangsu Province Strategic Emerging Industry Fund of Funds, and the proposed sub-fund is Wuxi Huayu Integrated Circuit Industry Fund, and the management agency is CRRC Fund Management (Beijing) Co., Ltd. The total scale of the fund is 1 billion yuan, registered in Wuxi Binhu District, with a duration of 8 years, mainly invested in the integrated circuit fields supported by Jiangsu Province and CRRC, such as vehicle-grade chips, semiconductor IC design, semiconductor equipment, and semiconductor materials.

[Secondary Market Overview].

In January this year, one semiconductor company, Huangshan Valley Jie, was listed on the A-share Growth Enterprise Market, raising a total of about 550 million yuan in the initial offering. According to public information, Huangshan Valley Jie specializes in the research and development, manufacturing and sales of power semiconductor module heat dissipation substrates, and its products are mainly used in the field of new energy vehicles, and also have application prospects in new energy power generation, energy storage and other fields.

In January, among the A-share listed companies, Zhuosheng Micro released a fixed increase plan, planning to raise no more than 3.5 billion yuan, and the funds to be raised will be mainly used for RF chip manufacturing expansion projects to meet the needs of market integration, modularization and customization.

In terms of mergers and acquisitions of listed companies, a number of listed companies in the semiconductor field disclosed their mergers and acquisitions plans in January, and some of the latest mergers and acquisitions progress information is as follows

Venture Capital Connect: The primary market service platform of Cailianshe and the Science and Technology Innovation Board Daily, was listed on the Shanghai Data Exchange in April 2022. Through Xingkuang data, primary market investment and financing data, enterprise innovation evaluation laboratory, innovative company database, self-selected stocks of unlisted companies, early knowledge of pre-listed companies and industry investment research, etc., it provides a one-stop service system from data products to solutions for innovative companies and venture capital institutions.

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