Yaxiang System Integration Technology Wins Bid for USD115 Million 12-Inch Wafer Project in Hefei
Tang Shihua
DATE:  Aug 21 2017
/ SOURCE:  Yicai
Yaxiang System Integration Technology Wins Bid for USD115 Million 12-Inch Wafer Project in Hefei Yaxiang System Integration Technology Wins Bid for USD115 Million 12-Inch Wafer Project in Hefei

(Yicai Global) Aug. 21 -- Yaxiang System Integration Technology (Suzhou) Co. will take part in the construction of semiconductor firm Hefei Chang Xin Integrated Circuit Co.'s 12-inch memory wafer manufacturing base, which has a total project budget of USD115 million.

Yaxiang System has won the bid to supply the power system of H03 process for Hefei Chang Xin's 12-inch memory wafer manufacturing base, the Suzhou-based company said on Aug. 18. Hefei Chang Xin is the constructor of the manufacturing base. However, Yaxiang has yet to sign a project contract with the inviting party, the statement added.

Per public information, Yaxiang System manufactures dust- and bacteria-free purification systems and equipment as well as relevant mechanical, electrical and instrument control products, and offers assembly services.

Hefei Chang Xin's 12-inch memory wafer manufacturing base is designed to produce 1.5 million pieces of wafers a year, with phase-one investment of CNY53.4 billion (USD8 billion).

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Keywords:   Computer Chips,Yaxiang System,Hefei Chang Xin